In the current era of rapid development of digitalization and intelligence, edge-side AI chips are standing at the critical juncture of transformative changes. Their capability to process data locally at end devices has significantly offset the limitations of cloud computing, propelling the industry onto a fast-track development trajectory. The "Edge-Side AI Chip Technology and Application Forum" is dedicated to establishing a professional communication and collaboration platform for industry stakeholders, aiming to drive technological innovation and application advancement in the field of edge-side AI chips.

The Edge AI Chip New Architectures and Applications Forum has convened various stakeholders in the edge-side AI chip industry ecosystem, including international and domestic edge-side chip enterprises, domestic edge-side module manufacturers, large model & algorithm companies, and end-use device manufacturers,etc. The forum features a diverse range of activities, including independent keynote speeches: industry leaders from large model enterprises, chip companies, and application firms are invited to deliver thematic addresses, sharing cutting-edge technological achievements, innovative application cases, and profound insights into industry development trends, offering attendees a high-value knowledge feast. In addition, the forum will invite guests to discuss topics such as low-power chip technologies for wearable devices, new application scenarios of FPGA technology, and related technical trends.