In the semiconductor industry, as Moore's Law approaches its physical limits, but the demand for higher performance, lower power consumption, and further miniaturization is increasing day by day. In this context, Chiplet technology and advanced packaging have emerged as the key force to promote the continuous progress of the industry. Chiplet splits complex chips into multiple small chips, which are interconnected through advanced packaging technology, effectively breaking through the bottlenecks of large chips in performance and yield, and reducing design complexity and cost. According to Omdia's forecast, the chiplet packaging and testing market size will reach US$5.8 billion in 2024, with a compound growth rate of about 23% from 2024 to 2035, and the prospects are broad.

The Advanced Packaging and TGV Technology Innovation Forum will convene industry experts, enterprise leaders, and research pioneers to explore the frontiers of semiconductor innovation. During the forum, in-depth discussions will be held on chiplet design architecture and advanced packaging processes (such as 2.5D and 3D packaging). Sessions will focus on how to overcome key technical challenges, accelerating industrial commercialization, and establishing robust industry standards and a collaborative ecosystem. By fostering deep integration between industry, academia, and research, the forum aims to lay a solid foundation for the future of Chiplet and advanced packaging technologies, propelling the semiconductor industry to reach new heights.

Additionally, the forum will invite guests to discuss the development trends of TGV technology and low-temperature bonding 3D integration technology.