In today's burgeoning semiconductor industry, as chip performance continuously advances and process technologies become increasingly sophisticated, the importance of analysis and testing has grown immensely. From wafer fabrication to chip packaging, precise inspection at every stage is indispensable for ensuring product yield, controlling costs, and driving technological innovation. Whether it is thin-film thickness measurement, pattern defect inspection, or electrical and functional testing, analytical technologies are integral across the entire semiconductor value chain. They serve as the critical foundation for guaranteeing product quality and sustaining the industry's steady progress.

The Semiconductor Analysis & Testing Applications and Equipment Integrated Development Forum will convene senior experts, research elites, and industry leaders to focus on the cutting edge of the semiconductor field. The agenda will feature in-depth discussions on the principles of advanced inspection technologies, the development and application of novel equipment, and the integration of AI-assisted testing. Meanwhile, in response to current industry pain points, the key objective is to collaboratively devise solutions for pressing industry challenges, such as enhancing detection accuracy and optimizing efficiency. By fostering deep collaboration between industry, academia, and research, the forum aims to provide a powerful impetus for technological innovation and industrial upgrading in semiconductor analysis and testing.