Organizer
China International Optoelectronic Exposition (CIOE)
China Integrated Circuit Innovation Alliance
Host
Shenzhen Zhongxincai Exhibition Co., Ltd.
JWinsights (Shanghai) Technology Co., Ltd
Core equipment and materials are the foundation of semiconductor manufacturing, as their performance determines chip quality and production efficiency. However, technological bottlenecks and external restrictions in these key areas pose a fundamental constraint on the domestic industry's development.
The Semiconductor Manufacturing Core Equipment and Material Development Forum will convene senior experts, research elites, and industry leaders to focus on the cutting edge of the semiconductor field. The agenda will feature in-depth discussions on the principles of advanced inspection technologies, the development and application of novel equipment, and the integration of AI-assisted testing. Meanwhile, in response to the current industrial predicaments, strategies for domestic substitution will be jointly discussed to promote the deep integration of industry, academia, research, and application, and be committed toproviding an exchange platform and intellectual support for the technological development and industrial upgrading of key equipment materials in semiconductor manufacturing. The forum will also invite guests to discuss topics related to the green manufacturing of integrated circuits.
General Manager of the CMP Business Unit, Hwatsing Technology Co., Ltd
Deputy Head, Suzhou TZTEK Technology Co., Ltd
Application Engineer, 3M CHINA
Manager, Wuxi Haiyi Semiconductor Technologies Co Ltd
Technical Engineer,Guangzhou Viewsitec
Chief Scientist,Hakodi Megasonic Technology (Shenzhen) Co., Ltd