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The 5th Development of the Third - Generation Semiconductor Industry Summit Forum (Finished)
Time：2024-06-26/06-27
Venue：Conference Room, Hall 6
Language：

Sponsor/Organizer

Shenzhen Zhongxincai Exhibition Co., Ltd.


Co-organizer

China Communications Industry Association (CCIA)

Jiangsu Semiconductor Industry Association

Zhejiang Semiconductor Industry Association

Shenzhen Semiconductor Industry Association

Chengdu Integrated Circuit Industry Association


Sponsor

Jiangsu KuaiKeXin Equipment Technology Co., Ltd.


With the vigorous development of new energy vehicles, the continuous advancement of 5G infrastructure construction, and the continuous acceleration of technology iteration in the photovoltaic industry, the third-generation semiconductor has shown a broad market prospect and has become an important track for global semiconductor technology research and industrial competition. Governments at all levels in my country have also strongly supported the development of the third-generation semiconductor industry from the aspects of industrial policies and development plans. Driven by both the market and policies, my country's third-generation semiconductor industry has entered a golden stage of development. Based on this, SEMI-e 2024 The 5th Third Generation Semiconductor Industry Development Summit Forum is divided into two major sections: Silicon carbide & Gallium nitride, to provide manufacturers and professionals with a comprehensive understanding of market trends and technological innovations, thereby facilitating strategic decision-making and fostering industry collaboration.


Conference agenda

The 5th Development of the Third - Generation Semiconductor Industry Summit Forum (Finished)
TimeTopicsSpeakers
09:30-10:00TopicsXueguang Li, Inner Mongolia JH Special Carbon Technology Co., Ltd.
Session 1: Analysis of the Current Situation and Application Prospects of GaN Technology June 26, 2024
10:00-10:20Key Factors for the Large - scale Application of Gallium Nitride (GaN)Zhenhong Zhou, CEO, BelGaN
10:20-10:40Key Factors for the Large - scale Application of Gallium Nitride (GaN)Wenbin Xie, Senior Product Application Engineer, Innoscience (Shenzhen) Semiconductor Co., Ltd.
10:40-11:00The Future is Here: Development of Gallium Nitride Devices in High - power ApplicationsDajiang Zhang, R&D Director, Zhuhai GaFuture Technology Co., Ltd.
11:00-11:20Introduction to Gallium Nitride EpitaxyLiteng Lin, General Manager, Shaanxi Yuteng Electronics Technology Co., Ltd.
11:20-11:40Research on the Growth and Processing of Gallium Nitride CrystalsShouzhi Wang, General Manager, Shandong JingGa Semiconductor Co., Ltd.
11:40-12:00Introduction on GaN Power Electronics Applications and Epitaxy TechnologyHu Liang, General Manager/CTO/Chief Scientist, Fuzhou GaValley Semiconductor Co., Ltd.
Session 2: Analysis of the Current Situation and Market Trends of SiC Technology June 26, 2024
14:00-14:20Industrialization Progress of Keyou's 8 - inch Silicon Carbide SubstrateShengtao Zhang, R&D Techology Director, Keyou Semiconductor
14:20-14:40Research on the Development Trend of SiC Substrate Wafer Size and the Direction of Significant Cost Reduction at the Current StageChunyang Guang, Director and President, Jiangsu Jixin Advanced Materials Co., Ltd.
14:40-15:00Solutions for Large - scale Mass Production of Compound Semiconductor EpitaxyZiwen Fang, General Manager, AIXTRON
15:00-15:20Technology and Progress of Large - diameter SiC EpitaxyGuoliang Zhang, Marketing Manager, Hebei Puxing Electronics Technology Co., Ltd.
15:20-15:40Defect Detection of SiC Substrates and Epitaxial WafersYuzhong Chen, CEO, Timetech Spectra Co., Ltd.
15:40-16:00Discussion on the Abrasive and Polishing Consumable Solutions for SiC SubstratesRan Liu, Director of Application Technology, Shenzhen Zhongji New Materials Co., Ltd.
Session 3: Current Situation and Analysis of GaN & SiC Application Market June 27, 2024
09:40-10:00Host Jinghui Li，Guangzhou Yuesheng Semiconductor Equipment Co., Ltd.
10:00-10:20Progress of Automotive - grade Power SemiconductorsXiongfei Cai, Deputy General Manager, Basic Semiconductor Co., Ltd.
10:20-10:40GaN Born for Innovation: Applications Define Devices, Market Drives ProgressLezhi Wang, Co-founder, Guangdong Zhineng Technology Co., Ltd.
10:40-11:00Navitas Semiconductor's GaN & SiC Usher in a New Chapter in Vehicle Power Supply DesignKaixiang Xiao, Marketing Manager, Navitas Semiconductor
11:00-11:20High - quality 4H - SiC Substrates and Epitaxial Materials: Progress and Challenges Yu Guo, Technical Director, TankeBlue Semiconductor Co., Ltd.
Session 4: Explore the preparation of new semiconductor (GaN/SiC) materials June 27, 2024
14:00-14:20Application and Development of Diamond Wire Sawing Technology in the Semiconductor IndustryYapeng Yu, Industry Solutions Manager, Qingdao Gaoce Technology Co., Ltd.
14:20-14:40Research on Domestic Semiconductor Wet - processing EquipmentWenchao Song, Deputy Director of Semiconductor Cleaning Equipment Division, The 45th Research Institute of China Electronics Technology Group Corporation (CETC)
14:40-15:00Demand - driven, Technological Innovation, Building a New Ecosystem for China's SiC IndustryChunxue Lyu, Deputy General Manager of Compound Semiconductor Industry Development Department, NAURA Technology Group Co., Ltd.
15:00-15:20Overall Solution for Semiconductor Substrate CMP MaterialsZefang Zhang, Chairman, Zhejiang BolainaRun Electronic Materials Co., Ltd.
15:20-15:40ECMP Solution for SiC SubstratesChangyi Cai, Senior Director of R&D Laboratory, Beijing Jingyi Jingwei Technology Co., Ltd.
15:40-16:00Application of Water - jet - guided Laser in Micro - precision Processing of Semiconductor MaterialsLingliang Mei, General Manager, Dongguan Keshite Technology Co., Ltd.