Shenzhen International Semiconductor Exhibition & IC Exhibition (SEMI-e) will be held at the Shenzhen World Exhibition and Convention Center from September 10 to 12, 2025. As a highly influential and professional semiconductor exhibition in the industry, SEMI-e 2025 is at the forefront of the industry, spanning the upstream and downstream of the industry chain. It will gather more than 900 quality exhibitors, covering an exhibition area of 60,000 m². It’ll showcase a wide range of products including chips and chip design, semiconductor equipment, semiconductor material, advanced packaging, semiconductor core parts, wide bandgap semiconductor and power device, and AI computing power, etc. It is committed to creating a multi-dimensional technology event covering the entire semiconductor industry chain.

SEMI-e will be held concurrently with China International Optoelectronic Exposition (CIOE), jointly creating a super event of optoelectronic technology and the semiconductor industry with a scale of 320,000 square meters. The cooperation of the two exhibitions not only deeply improves the layout of the semiconductor industry chain but also forms a solid foundation where the upstream and downstream industry chains rely on each other and develop synergistically, jointly contributing to the prosperity of the application market.


Highlights:
Co-located EventBooth Application
Exhibit Profile

Chip Design and Application

IC and related electronic product design, EDA, AI computing power chips, Storage chips, Automotive chips, Smart home appliance chips, Artificial intelligence chips and Internet of Things, Artificial intelligence, Automotive electronics, Smart cities, Smart terminals, Health care, etc.

IC Manufacturing

Semiconductor wafer manufacturing, Semiconductor packaging & testing technologies and products, etc.

Advanced Packaging

Flip-chip, Bump, Wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), Fan-out wafer-level packaging and other designs, materials, testing, equipment, etc.

Semiconductor Equipment

Wafer equipment/Packaging and testing equipment, Semiconductor packaging equipment, Semiconductor testing equipment, IC testing equipment, Advanced packaging progress (such as SiP, 3D packaging) equipment, Power device equipment, etc.

Compound Semiconductor and Power Device

Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including Power devices, Radio frequency devices and Upstream equipment, Materials, etc.

Semiconductor Material

Monocrystalline silicon, Wafers and Silicon-based materials, Polishing pads, Masks, Sputtering targets, Polishing solutions, Etching solutions, Ceramic packaging materials, Bonding wires, Lead frames, Packaging substrates, Photoresists, Thin film deposition materials, Special gases, Ultrapure water, Plastic encapsulation materials, High-performance plastics, etc.

Semiconductor Core Part

Machine vision, Sensors, Sealing rings, Precision bearings, Metal parts, Valves, Silicon/SiC parts, Robots, Quartz parts, Filters, RF power supplies, Ceramic parts, ESC electrostatic suction cups, Pressure gauges, Pumps, Mass flow controllers, Precision stepper motors, Motion control, Servo motors, Linear modules, Cleanroom cable carriers, Encapsulation molds, Refrigeration equipment, Induction heaters, etc.

AI Computing Power

AI chips, Servers, Switches, Power supplies, Liquid cooling and temperature control, etc.

Visiting Companies
Floor Plan
Booth ApplicationWhy Exhibit