About SEMI-e
Shenzhen International Semiconductor Exhibition & IC Exhibition (SEMI-e 2025), a premier global event in the semiconductor industry, will bring together more than 1,000 distinguished global exhibitors to showcase the entire industry chain. Spanning from EDA tools, semiconductor materials, equipment manufacturing to chip design and advanced packaging applications. The exhibition features seven dedicated theme pavilions, including Chip Design and Application, IC Manufacturing, Wafer Equipment, Advanced Packaging Equipment, Core Parts and Materials, Compound Semiconductors and Power Devices, AI Computing Power. This professional platform synergizes business networking, international collaboration, and brand exposure for the semiconductor manufacturing, integrated circuits, electronic power, electronic manufacturing, display manufacturing, and related industries including automotive, information and communications, and consumer electronics sectors, strategically designed to unlock global business opportunities across the semiconductor value chain.
Time: September 10-12, 2025
Venue: Shenzhen World Exhibition and Convention Center, China
Sponsors：China International Optoelectronic Exposition (CIOE), Integrated Circuit Industry Technology Innovation Alliance (ICTIA)
Organizers：Shenzhen Zhongxincai Exhibition Co., Ltd, JW Insights (Xiamen) Co., Ltd
Theme Pavilion
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Chip Design and ApplicationIC and related electronic product design, EDA, AI computing power chips, Storage chips, Automotive chips, Smart home appliance chips, Artificial intelligence chips and Internet of Things, Artificial intelligence, Automotive electronics, Smart cities, Smart terminals, Health care, etc. -
IC ManufacturingSemiconductor wafer manufacturing, Semiconductor packaging & testing technologies and products, etc. -
Advanced PackagingFlip-chip, Bump, Wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), Fan-out wafer-level packaging and other designs, materials, testing, equipment, etc. -
Semiconductor EquipmentWafer equipment/Packaging and testing equipment, Semiconductor packaging equipment, Semiconductor testing equipment, IC testing equipment, Advanced packaging progress (such as SiP, 3D packaging) equipment, Power device equipment, etc. -
Compound Semiconductor and Power Device Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including Power devices, Radio frequency devices and Upstream equipment, Materials, etc. -
Semiconductor MaterialMonocrystalline silicon, Wafers and Silicon-based materials, Polishing pads, Masks, Sputtering targets, Polishing solutions, Etching solutions, Ceramic packaging materials, Bonding wires, Lead frames, Packaging substrates, Photoresists, Thin film deposition materials, Special gases, Ultrapure water, Plastic encapsulation materials, High-performance plastics, etc. -
Semiconductor Core PartMachine vision, Sensors, Sealing rings, Precision bearings, Metal parts, Valves, Silicon/SiC parts, Robots, Quartz parts, Filters, RF power supplies, Ceramic parts, ESC electrostatic suction cups, Pressure gauges, Pumps, Mass flow controllers, Precision stepper motors, Motion control, Servo motors, Linear modules, Cleanroom cable carriers, Encapsulation molds, Refrigeration equipment, Induction heaters, etc.
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AI Computing PowerAI chips, Servers, Switches, Power supplies, Liquid cooling and temperature control, etc.
Co-located Event
SEMI-e 2025 (Shenzhen International Semiconductor Exhibition & IC Exhibition) and CIOE will be held concurrently this year, jointly presenting a 320,000 sqm showcase of optoelectronic and semiconductor industry chains.
The 26th China International Optoelectronic Exposition (CIOE 2025) showcases core products and technologies in the semiconductor industry chain, such as sensors and optoelectronic devices, including optoelectronic chips, optical components, optical modules, optical lenses, LiDAR, 3D vision, etc. The co-located event works in tandem to serve a wide range of professionals from multiple intersecting fields, including semiconductor manufacturing, display, data centers, and automotives, providing one-stop and efficient empowerment to key downstream areas.
The 26th China International Optoelectronic Exposition (CIOE 2025) showcases core products and technologies in the semiconductor industry chain, such as sensors and optoelectronic devices, including optoelectronic chips, optical components, optical modules, optical lenses, LiDAR, 3D vision, etc. The co-located event works in tandem to serve a wide range of professionals from multiple intersecting fields, including semiconductor manufacturing, display, data centers, and automotives, providing one-stop and efficient empowerment to key downstream areas.
ICIA Events
China Integrated Circuit Innovation and Development Forum
The forum will exclusively invite 100 industry academicians, experts, corporate executives and policymakers to conduct in-depth discussions on strategic directions such as third-generation semiconductors, Chiplet advanced packaging, and compute-in-memory (CIM) architectures.
The 27th Annual Conference on Integrated Circuit Manufacturing and Supply Chain Innovation and Development
10+ technical sessions will be set up to create a precise communication platform connecting foundries, design houses, system OEMs, and chip suppliers. It is expected to attract over 3,000 industry decision-makers across the semiconductor industrial chain.
The forum will exclusively invite 100 industry academicians, experts, corporate executives and policymakers to conduct in-depth discussions on strategic directions such as third-generation semiconductors, Chiplet advanced packaging, and compute-in-memory (CIM) architectures.
The 27th Annual Conference on Integrated Circuit Manufacturing and Supply Chain Innovation and Development
10+ technical sessions will be set up to create a precise communication platform connecting foundries, design houses, system OEMs, and chip suppliers. It is expected to attract over 3,000 industry decision-makers across the semiconductor industrial chain.
Program
20+ Concurrent Conferences
A series of concurrent forums will invite industry leaders, technical experts, and scientific researchers from the semiconductor industry, application fields, and research institutes to conduct a comprehensive and in-depth discussion about the latest technologies, research directions, and market trends in the semiconductor field, as well as innovative developments in downstream applications.
Some of the topics are:
Semiconductor Manufacturing and Advanced Packaging: Semiconductor industry technology, Advanced packaging and materials, TGV technology
Compound Semiconductors and Power Devices: Third-generation semiconductors, automotive-grade power semiconductors
Chips and Chip Design: AI computing power chips, Automotive-grade chips, EDA software
Conference List
A series of concurrent forums will invite industry leaders, technical experts, and scientific researchers from the semiconductor industry, application fields, and research institutes to conduct a comprehensive and in-depth discussion about the latest technologies, research directions, and market trends in the semiconductor field, as well as innovative developments in downstream applications.
Some of the topics are:
Semiconductor Manufacturing and Advanced Packaging: Semiconductor industry technology, Advanced packaging and materials, TGV technology
Compound Semiconductors and Power Devices: Third-generation semiconductors, automotive-grade power semiconductors
Chips and Chip Design: AI computing power chips, Automotive-grade chips, EDA software
Conference List
Subscribe Us
To better understand SEMI-e, exhibitors and showcase products, we will provide a series of semiconductor product brochures, and regularly send the latest industry information, exhibition information, industry reports, etc.
Key Visiting Companies
- Foundry/Packing and Testing TSMC, Tower Semiconductor, PSMC, UMC, VIS, Samsung Electronics, SK Hynix, SMIC, CR Micro, CanSemi, GTA Semiconductor…
- Chip and Chip Design Qualcomm, NVIDIA, Broadcom, HiSilicon, GUOXINMICRO, Unisoc, Shanghai Fudan Microelectronics Group, Ingenic Semiconductor, Huada Semiconductor, STMicroelectronics N.V., NXP Semiconductors N.V., Infineon, Cambricon…
- Semiconductor Core Equipment North China Innovation Technology Group, Advanced Micro - Fabrication Equipment Inc. China(AMEC), Hangzhou ChangChuan Technology, ACM Research, Institute of Optics and Electronics (Chinese Academy of Sciences), Skyverse Technology, Hwatsing Technology…
Floor Plan
Exhibitor List
Product List