Theme Pavilions
Chip Design and Application
Automotive Chip Zone：Showcasing the full spectrum of automotive semiconductor innovations and applications, this zone features a dedicated ecosystem pavilion. It demonstrates collaborative synergies in upstream and downstream enterprises in the semiconductor value chain such as chip designers, automotive OEMs, and component suppliers.
Smart Home Appliance Chip Zone：Focusing on the intelligent transformation of home appliances, this zone spotlights core technologies such as low-power MCUs, wireless connection chips, and AI voice recognition chips. In addition, it showcases the breakthrough technologies in home appliance chips for energy efficiency optimization and standby power consumption control.
AI Chip Zone：development tools, it showcases breakthrough progress in quantum computing, large-model training, edge computing, etc.
Design and Application Zone：Covering IOT, AI, automotive electronics, smart cities, smart terminals, health care, and industrial applications, this zone demonstrates how integrated circuit technologies empower diverse sectors through physical demonstrations, case studies, etc.
IC Fabrication
Showcasing semiconductor manufacturing processes, semiconductor packaging processes & testing technologies, etc. and introducing new manufacturing models such as green manufacturing and advanced manufacturing.
Wafer Equipment
Focusing on precision equipment required in the wafer processing chain like semiconductor wafer equipment, etc.
Advanced Packaging Equipment
Semiconductor packaging equipment, Semiconductor testing equipment, IC testing instruments, including advanced packaging process equipment (such as SiP, 3D packaging), etc.
Semiconductor Equipment Core Parts & Raw Material
Focusing on key raw materials, components and auxiliary materials in integrated circuit manufacturing, such as monocrystalline silicon, silicon wafers, etc.
Compound Semiconductor & Power Device
Showcasing compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, radio frequency devices, and related upstream equipment materials.
AI Computing Power
Including AI chips, Servers, Switches, Power supplies, Liquid cooling temperature control, etc.
Exhibitor Profile
Chip Design and Application
IC and related electronic product design, EDA, AI computing power chips, Storage chips, Automotive chips, Smart home appliance chips, Artificial intelligence chips and Internet of Things, Artificial intelligence, Automotive electronics, Smart cities, Smart terminals, Health care, etc.
IC Fabrication
Semiconductor wafer manufacturing, Semiconductor packaging & testing technologies and products, etc.
Advanced Packaging
Flip-chip, Bump, Wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), Fan-out wafer-level packaging and other designs, materials, testing, equipment, etc.
Semiconductor Equipment
Wafer equipment/Packaging and testing equipment, Semiconductor packaging equipment, Semiconductor testing equipment, IC testing equipment, Advanced packaging progress (such as SiP, 3D packaging) equipment, Power device equipment, etc.
Compound Semiconductor and Power Device
Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including Power devices, Radio frequency devices and Upstream equipment, Materials, etc.
Semiconductor Material
Monocrystalline silicon, Wafers and Silicon-based materials, Polishing pads, Masks, Sputtering targets, Polishing solutions, Etching solutions, Ceramic packaging materials, Bonding wires, Lead frames, Packaging substrates, Photoresists, Thin film deposition materials, Special gases, Ultrapure water, Plastic encapsulation materials, High-performance plastics, etc.
Semiconductor Equipment Core Part
Machine vision, Sensors, Sealing rings, Precision bearings, Metal parts, Valves, Silicon/SiC parts, Robots, Quartz parts, Filters, RF power supplies, Ceramic parts, ESC electrostatic suction cups, Pressure gauges, Pumps, Mass flow controllers, Precision stepper motors, Motion control, Servo motors, Linear modules, Cleanroom cable carriers, Encapsulation molds, Refrigeration equipment, Induction heaters, etc.
AI Computing Power
AI chips, Servers, Switches, Power supplies, Liquid cooling and temperature control, etc.
Key Exhibitors
Exhibitor List
Product List
