Chip Design and Application

IC and related electronic product design, EDA, AI computing power chips, Storage chips, Automotive chips, Smart home appliance chips, Artificial intelligence chips and Internet of Things, Artificial intelligence, Automotive electronics, Smart cities, Smart terminals, Health care, etc.

IC Fabrication

Semiconductor wafer manufacturing, Semiconductor packaging & testing technologies and products, etc.

Advanced Packaging

Flip-chip, Bump, Wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), Fan-out wafer-level packaging and other designs, materials, testing, equipment, etc.

Semiconductor Equipment

Wafer equipment/Packaging and testing equipment, Semiconductor packaging equipment, Semiconductor testing equipment, IC testing equipment, Advanced packaging progress (such as SiP, 3D packaging) equipment, Power device equipment, etc.

Compound Semiconductor and Power Device

Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including Power devices, Radio frequency devices and Upstream equipment, Materials, etc.

Semiconductor Material

Monocrystalline silicon, Wafers and Silicon-based materials, Polishing pads, Masks, Sputtering targets, Polishing solutions, Etching solutions, Ceramic packaging materials, Bonding wires, Lead frames, Packaging substrates, Photoresists, Thin film deposition materials, Special gases, Ultrapure water, Plastic encapsulation materials, High-performance plastics, etc.

Semiconductor Equipment Core Part

Machine vision, Sensors, Sealing rings, Precision bearings, Metal parts, Valves, Silicon/SiC parts, Robots, Quartz parts, Filters, RF power supplies, Ceramic parts, ESC electrostatic suction cups, Pressure gauges, Pumps, Mass flow controllers, Precision stepper motors, Motion control, Servo motors, Linear modules, Cleanroom cable carriers, Encapsulation molds, Refrigeration equipment, Induction heaters, etc.

AI Computing Power

AI chips, Servers, Switches, Power supplies, Liquid cooling and temperature control, etc.