THE 7TH SHENZHEN INTERNATIONAL SEMICONDUCTOR EXHIBITION

Shenzhen World Exhibition and Convention Center, China
September 10-12, 2025
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About SEMI-e

The 7th Shenzhen International Semiconductor Exhibition (SEMI-e 2025), a premier industry event, will take place at the Shenzhen World Exhibition and Convention Center from September 10 to 12, 2025. Spanning the full semiconductor ecosystem, the exhibition will bring together more than 900 industry-leading exhibitors across 60,000 square meters of exhibition space, showcasing semiconductor material, semiconductor equipment, semiconductor manufacturing, chips and chip design, advanced packaging, semiconductor core parts, wide bandgap semiconductor and power device, AI computing power, etc. This integrated platform drives technological collaboration while creating unmatched business opportunities for global industry players.

60,000㎡

Exhibition Area
1,000+

Exhibitors
50,000+

Visitors
20+

Forums

Booth Application Visitor Registration

Highlights

1.

900+ global semiconductor innovators from the whole semiconductor industry chain.
2.

60,000 square meters tech hub demonstrating end-to-end ecosystem solutions.
3.

Asia's only cross-industry chain exhibition integrating semiconductor design, manufacturing, packaging, and application ecosystems.
4.

Co-located with China International Optoelectronic Exposition (CIOE), enabling one-stop access to optoelectronic and semiconductor convergence technologies.

5.

Focus on power semiconductors and compound third-generation semiconductors, AI chips, automotive semiconductors and other hot sectors.
6.

The concurrent forums delve into the latest industry developments from multiple dimensions including semiconductor design, manufacturing, packaging and chip application.
7.

Amidst the rapid evolution of China's semiconductor industry ecosystem, SEMI - e is the premier platform for finding new potential suppliers.

Theme Zones

Semiconductor Manufacturing and Advanced Packaging

Chip and
Chip Design

AI Computing
Power

Semiconductor
Core Part

Wide Bandgap Semiconductor and Power Device

Exhibit Profile

Chip and Chip Design

Chip Design, Communication Chip, Memory Chip, CPU Chip, Sensor Chip, Analogue Chip, Digital Chip, Power Management & Power Chip, RF Chip, Driver Chip;
AI Computing Power

AI Chip, Server, Switch, Power Supply, Liquid Cooling and Temperature Control;
Semiconductor Equipment

Manufacturing Equipment, Packaging Equipment, Inspection and Test Equipment, Assembly Equipment, Facilities, Pollution Control Equipment, Processing Equipment, General Equipment；
Semiconductor Material

Manufacturing Material, Packaging Material, Wafer / Substrate Material;
Advanced Packaging

Flip Chip Packaging, Wafer Level Packaging, 2.5D Packaging, 3D Packaging, Bump Packaging, Fan-out Wafer Level Packaging;
Wide Bandgap Semiconductor & Power Device

Silicon Carbide, Gallium Nitride, Diamond, Gallium Oxide, Cubic Boron Nitride, Aluminium Nitride, Graphite & Carbon Material, Equipment & Supporting Facilities, Power Device.
Semiconductor Core Part

Sealing Ring, Precision Bearing, Metal Part, Quartz / Silicon / SiC / Ceramic Component, Power Supply (RF Power Supply, DC Power Supply, Plasma Power Supply, etc.), Stepper Motor, Motion Control, Servo Motor, Pump / Semiconductor Valve / Pressure, Electrostatic Chuck, Flow Meter, Machine Vision, Sensor;

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Target Visitors

● Semiconductor Manufacturing & Service
● Semiconductor Core Product
● Power Electronics
● Electronics Manufacturing
● Lighting & Display
● Automotive
● Energy
● Consumer Electronics / Entertainment
● Industrial
● Information & Communication
● University / Research Institute

Co-located Event

SEMI-e (the 7th Shenzhen International Semiconductor Exhibition) and CIOE will be held concurrently this year, jointly presenting a 320,000 sqm showcase of optoelectronic and semiconductor industry chains.

Enhancing semiconductor industry chain integration through co-located exhibitions, with CIOE's complete optoelectronics value chain featuring exhibitors from seven Chinese Academy of Sciences institutes and top manufacturers of photonic chips, optical modules, sensors, and lasers, thereby enabling seamless downstream connectivity for SEMI-e.

The two exhibitions jointly serve professionals in fields such as semiconductor manufacturing, integrated circuits, electronic power, electronic manufacturing, display manufacturing, etc. by building a one-stop and efficient platform that promotes the development of downstream sectors.