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About SEMI-e

Shenzhen International Semiconductor Exhibition & IC Exhibition (SEMI-e 2025), a premier global event in the semiconductor industry, will bring together more than 1,000 distinguished global exhibitors to showcase the entire industry chain. Spanning from EDA tools, semiconductor materials, equipment manufacturing to chip design and advanced packaging applications. The exhibition features seven dedicated theme pavilions, including Chip Design and Application, IC Manufacturing, Wafer Equipment, Advanced Packaging Equipment, Core Parts and Materials, Compound Semiconductors and Power Devices, AI Computing Power. This professional platform synergizes business networking, international collaboration, and brand exposure for the semiconductor manufacturing, integrated circuits, electronic power, electronic manufacturing, display manufacturing, and related industries including automotive, information and communications, and consumer electronics sectors, strategically designed to unlock global business opportunities across the semiconductor value chain.

  • 60,000㎡

    Exhibition Area

  • 1,000+

    Exhibitors

  • 50,000+

    Visitors

  • 20+

    Forums

Booth ApplicationVisitor Registration

Highlights

  • 1.

    900+ global semiconductor innovators from the whole semiconductor industry chain.

  • 2.

    60,000 square meters tech hub demonstrating end-to-end ecosystem solutions.

  • 3.

    Asia's only cross-industry chain exhibition integrating semiconductor design, manufacturing, packaging, and application ecosystems.

  • 4.

    Co-located with China International Optoelectronic Exposition (CIOE), enabling one-stop access to optoelectronic and semiconductor convergence technologies.

  • 5.

    Focus on power semiconductors and compound third-generation semiconductors, AI chips, automotive semiconductors and other hot sectors.

  • 6.

    The concurrent forums delve into the latest industry developments from multiple dimensions including semiconductor design, manufacturing, packaging and chip application.

  • 7.

    Amidst the rapid evolution of China's semiconductor industry ecosystem, SEMI-e is the premier platform for finding new potential suppliers.

Exhibit Profile

  • Chip Design and Application

    IC and related electronic product design, EDA, AI computing power chips, Storage chips, Automotive chips, Smart home appliance chips, Artificial intelligence chips and Internet of Things, Artificial intelligence, Automotive electronics, Smart cities, Smart terminals, Health care, etc.

  • Semiconductor Core Part

    Machine vision, Sensors, Sealing rings, Precision bearings, Metal parts, Valves, Silicon/SiC parts, Robots, Quartz parts, Filters, RF power supplies, Ceramic parts, ESC electrostatic suction cups, Pressure gauges, Pumps, Mass flow controllers, Precision stepper motors, Motion control, Servo motors, Linear modules, Cleanroom cable carriers, Encapsulation molds, Refrigeration equipment, Induction heaters, etc.

  • Advanced Packaging

    Flip-chip, Bump, Wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), Fan-out wafer-level packaging and other designs, materials, testing, equipment, etc.

  • Semiconductor Equipment

    Wafer equipment/Packaging and testing equipment, Semiconductor packaging equipment, Semiconductor testing equipment, IC testing equipment, Advanced packaging progress (such as SiP, 3D packaging) equipment, Power device equipment, etc.

  • Compound Semiconductor and Power Device

    Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including Power devices, Radio frequency devices and Upstream equipment, Materials, etc.

  • Semiconductor Material

    Monocrystalline silicon, Wafers and Silicon-based materials, Polishing pads, Masks, Sputtering targets, Polishing solutions, Etching solutions, Ceramic packaging materials, Bonding wires, Lead frames, Packaging substrates, Photoresists, Thin film deposition materials, Special gases, Ultrapure water, Plastic encapsulation materials, High-performance plastics, etc.

  • IC Manufacturing

    Semiconductor wafer manufacturing, Semiconductor packaging & testing technologies and products, etc.

  • AI Computing Power

    AI chips, Servers, Switches, Power supplies, Liquid cooling and temperature control, etc.
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Visitor Profile

  • ● Foundry / Packaging and Testing

  • ● Chip and Chip Design

  • ● Semiconductor Core Equipment

  • ● Power Electronics

  • ● Electronics Manufacturing

  • ● Lighting & Display

  • ● Automotive

  • ● Energy

  • ● Consumer Electronics / Entertainment

  • ● Industrial

  • ● Information & Communication

  • ● University / Research Institute

Co-located Event

SEMI-e (Shenzhen International Semiconductor Exhibition & IC Exhibition ) and CIOE will be held concurrently this year, jointly presenting a 320,000 sqm showcase of optoelectronic and semiconductor industry chains.


The China International Optoelectronic Exposition (CIOE) showcases core products and technologies in the semiconductor industry chain, such as sensors and optoelectronic devices, including optoelectronic chips, optical components, optical modules, optical lenses, LiDAR, 3D vision, etc.

It creates an upstream and downstream industrial chain that relies on each other. The co-located event works in tandem to serve a wide range of professionals from multiple intersecting fields, including semiconductor manufacturing, display, data centers, and automotives, providing one-stop and efficient empowerment to key downstream areas.


Pre-registration

Concurrent Conferences

  • Hot topics focused on:

  • ●

    EDA Design

  • ●

    Third and Fourth Generation Semiconductor

  • ●

    Semiconductor Manufacturing

  • ●

    Advanced Packaging & Material

  • ●

    Automotive Chip & Power Semiconductor

  • ●

    AI Computing Chip

  • ●

    Smart Charging

Floor Plan

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